CSP和FTSC工艺结晶器的冷却结构及传热能力  

Cooling Structure and Heat Transfer Capability of Mold for CSP and FTSC Process

作　　者：张慧[1] 丁毅[1,2] 陶红标[1] 刘和平[1] 杨晓江[3] 干勇[1] 

机构地区：[1]中国钢研科技集团公司连铸技术国家工程研究中心,北京100081 [2]马鞍山钢铁股份有限公司技术中心,安徽马鞍山243000 [3]唐山钢铁集团有限责任公司技术中心,河北唐山063016

出　　处：《钢铁研究学报》2010年第5期19-22,共4页Journal of Iron and Steel Research

基　　金：国家自然科学基金资助项目(50674034)

摘　　要：结合实际生产数据,比较和分析了CSP及FTSC工艺结晶器的冷却结构及传热能力,结果表明,热流密度计算模型中,FTSC和CSP结晶器内传热区高度分别为1 200 mm和1 010 mm,相同工况下二者的传热能力相近;CSP结晶器采用42条凹型水道及20条内径11 mm的圆型水道进行组合冷却,FTSC结晶器采用72条内径14 mm的圆型水道进行冷却;弯月面处FTSC结晶器铜板热面温度高于银铜的再结晶温度,铜板将发生局部变形,这是造成镀层龟裂或铜板裂纹的主要原因。Based on actual production data,the cooling structure and heat transfer capability of CSP and FTSC mold were investigated.The results indicate that the heights in heat transfer region of CSP and FTSC mold are 1200mm and 1010mm respectively.Therefore,it can be reformed that their heat transfer capability is similar on the same condition.The CSP mold is cooled with 42 concavity flumes and 20 round channels whose inside diameter is 11mm while FTSC mold is cooled with 72 round channels.The hot face temperature of FTSC mold is higher than recrystallization temperature of silver bearing copper.Therefore,copper plate will deform locally which is major reason for chap of nickel plating and tearing of copper plate.

关 键 词：漏斗型结晶器 冷却结构 传热能力 热流密度 

分 类 号：TF777.1[冶金工程—钢铁冶金]