铝基电镀铅-锡合金板栅电化学性能的研究  

A Study on the Electrochemical Performance of Aluminum Grid Plated with Pb-Sn Alloy Coating

作　　者：徐强[1] 王媛媛[1] 唐致远[1] 苏鹏[1] 

机构地区：[1]天津大学化工学院,天津300072

出　　处：《电镀与精饰》2010年第5期12-15,共4页Plating & Finishing

摘　　要：采用交流阻抗法、断路电位衰退法、循环伏安法等研究了铝基电镀铅-锡合金轻型板栅在硫酸溶液中的电化学行为及其氧化膜的性质,以阐明元素锡对电镀轻型板栅电化学性能的影响。实验结果表明,在铅镀层中添加少量的锡可显著降低铅合金镀层的阳极膜阻抗,促进氧化膜的生长,有利于PbO转变为PbO1+x。Electrochemical behavior of aluminum grid plated with Pb-Sn alloy coating in sulfuric acid solution and the property of oxidation film on the grid surface were investigated using methods of AC impedance,open-circuit potential decade and cyclic voltammetry for clarifying the effect of tin on the electrochemical performance of the grid.Experiments were carried out in 5mol/L H2SO4 solution and under 0.9V potential which are close to the environment and potential of positive grid in a deep discharge lead-acid storage battery.The experimental results showed that the impedance of oxidation film on the positive grid can be reduced remarkably by the addition of tin in the lead alloy coating.

关 键 词：铝基板栅 铅锡合金 电化学性能 阳极膜 

分 类 号：TQ153.2[化学工程—电化学工业]