铝黄铜基体电沉积Ni-P合金工艺  

Technology for Electrodeposition of Ni-P Alloy Coating on Al-Brass Substrate

作　　者：许洪胤[1] 李莉[2] 

机构地区：[1]江西理工大学材料与化学工程学院,江西赣州341000 [2]江西理工大学应用科学学院,江西赣州341000

出　　处：《材料保护》2010年第5期30-33,共4页Materials Protection

摘　　要：为了提高铝黄铜的耐蚀性能,采用次亚磷酸盐体系电镀Ni-P合金,从镀层沉积速度和外观角度,研究了镀液组成、pH值、电流密度、温度对镀层的影响,得出了最佳的工艺条件:40～60g/L硫酸镍,8～10g/L氯化镍,8～12g/L次亚磷酸钠,10～14g/L柠檬酸,25～35g/L硼酸,pH值2.5～3.0,电流密度45～55mA/cm2,温度58～70℃。采用本工艺得到的镀层均匀、光亮,耐蚀性优于铝黄铜。Ni-P alloy coating was prepared on the surface of Al-brass substrate via electroplating in hypophosphite bath. The effects of bath composition and pH value,current density and temperature on the deposition rate and appearance of the Ni-P alloy coating were studied,and the optimized bath composition and plating parameters were determined. Results indicate that the optimized plating bath is composed of 40~60 g/L NiSO4,8~10 g/L NiCl2,8~12 g/L NaH2PO2·H2O,10~14 g/L C6H8O7,25~35 g/L H3BO3,while the optimized plating parameters are determined to be pH value of 2.5~3.0,current density of 45~55 mA/cm2 and temperature of 58~70 ℃. The coating obtained at the optimized technology was uniform and bright,and had better corrosion resistance than Al-bass.

关 键 词：NI-P合金 电沉积 铝黄铜 沉积速率 

分 类 号：TQ153.2[化学工程—电化学工业]