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作 者:闫飞[1] 侯玲[1] 徐道荣[1] 陈明浩[1] 吴圣川[1]
机构地区:[1]合肥工业大学材料科学与工程学院
出 处:《航空制造技术》2010年第11期73-75,共3页Aeronautical Manufacturing Technology
摘 要:选用不同厚度的BAlSiMg钎料进行Cu/LF21炉中钎焊试验。结果表明,钎料层过薄,共晶反应中产生的液相较少,不能填满整个钎缝,反之,钎缝中生成较多的脆性相CuAl2和AlCu,导致焊缝在冷却过程中出现微裂纹,二者都会导致钎缝强度和接头强度降低。因此,要得到理想的接头,必须保证钎缝中的脆性相呈不连续分布或弥散状态存在。The furnace brazing of Cu/LF21 by using different solder thickness of BAlSiMg is studied. The results show that the solder layer is so thin that the liquid phase produced by eutectic reaction cannot fill the entire weld completely while the more brittle phase CuAl2 and AICu produced in the brazing seam zone can lead to coming along the micro-cracks in the cooling process of the weld so that both of them can lead to reducing joint strength of solder joints. Therefore, to obtain the ideal joint, the brittle phases in weld must be a non-continuous distribution or the dispersion state of existence.
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