活性炭对细菌浸出线路板中金属铜的影响研究  

Effect of activated carbon addition on copper recovery from printed circuit board by bacteria

作　　者：周培国[1] 郑正[2] 彭晓成[2] 王艳锦[2] 

机构地区：[1]南京林业大学木材工业学院,南京210037 [2]南京大学环境学院污染控制与资源化研究国家重点实验室,南京210093

出　　处：《环境工程学报》2010年第6期1426-1430,共5页Chinese Journal of Environmental Engineering

摘　　要：研究了活性炭对细菌生长和浸出铜的效应影响。结果表明活性炭的添加对细菌的生长有一定的抑制作用,但这种作用随着添加量的增加而减弱。Fe3+对Cu浸出速率较快,活性炭对浸出速率有一定的促进作用,但效果不明显,且最终Cu的浸出率只达到87%。活性炭的添加增大了浸出体系中的生物量,加速了对Fe2+的氧化速率,从而保持溶液中较高的Fe3+浓度,可以提高铜的浸出速率。但这种促进作用需要较高浓度的活性炭添加量才比较明显。Effect of activated carbon on growth of bacteria and leaching of copper was investigated.The results showed the addition of activated carbon could inhibit the growth of bacteria.And the inhibition was weakened with higher addition.The copper was leached rapidly with ferric ion.The addition of activated carbon could promote leaching at a certain extent,but the effect was not obvious.And the leaching rate was 87% finally.The addition of activated carbon promoted the leaching of copper for increasing the biomass in system of leaching,enhancing oxidation of ferrous ion and keeping higher concentration of ferric ion.To promote leaching,the activated carbon addition should be higher.

关 键 词：氧化亚铁硫杆菌 线路板 铜 活性炭 

分 类 号：X705[环境科学与工程—环境工程]