微流控芯片超声振动注射成型模具设计  

DESIGN OF ULTRASONIC VIBRATION ASSISTED INJECTION MOLD FOR MICROFLUIDIC CHIP

作　　者：李常峰[1] 蒋炳炎[1] 申瑞霞[1] 侯文潭[1] 

机构地区：[1]中南大学机电工程学院现代复杂装备设计与极端制造教育部重点实验室,长沙410083

出　　处：《工程塑料应用》2010年第2期67-71,共5页Engineering Plastics Application

基　　金：国家高技术研究发展计划(863)项目(2007AA04Z351);教育部科学技术研究重点资助项目(107086)

摘　　要：针对目前微流控芯片注射成型中微通道充填困难、成型精度低等问题,研究超声振动辅助注射成型微流控芯片的方法,设计出微流控芯片超声振动模具。创新性地引入热流道系统,实现了超声振动系统与注射成型模具的有效集成;独特的流道和型腔布置实现了芯片的基片和盖片同模同时成型;改进的二次顶出机构实现了芯片的无损脱模。Aiming at existing problems of injection molding of microfluidic chip, such as filling difficulty and low molding ac- curacy of microehannel, the method of ultrasonic vibration assisted injection molding of microfluidic chip was studied, and an ultrasonic vibration assisted injection mold for micrnfluidie chip was designed. The ultrasonic vibration system and injection mold were integrated effectively by introducing hot runner system innovatively. The unique disposal of runner system and cavity enabled the molding of substrate and coverslip simultaneously in a single mold. The nondestructive demoulding of microfluidic chip was achieved by using an improved secondary demoulding device.

关 键 词：超声振动 微流控芯片 注射成型 无损脱模 

分 类 号：TQ320.662[化学工程—合成树脂塑料工业]