DGE-BHBTMBP/E-51/DDS固化物的研究  

STUDY ON DGE-BHBTMBP/E-51/DDS CURED

作　　者：梁汲媛[1] 孙建中[1] 赵骞[1] 林宇腾[1] 周其云[1] 

机构地区：[1]化学工程联合国家重点实验室,浙江大学化学工程与生物工程学系,杭州310027

出　　处：《工程塑料应用》2010年第3期12-15,共4页Engineering Plastics Application

摘　　要：以4,4′-二氨基二苯基砜(DDS)为固化剂,用新型联苯芳酯型液晶环氧树脂[4,4′-双(4-羟基苯甲氧基)-3,3′,5,5′-四甲基联苯二缩水甘油醚](DGE-BHBTMBP)改性普通双酚A型环氧树脂(E-51),通过动态热机械性能分析、热重分析及扫描电子显微镜测试了DGE-BHBTMBP含量对DGE-BHBTMBP/E-51/DDS固化物的热性能和力学性能的影响。结果表明,加入DGE-BHBTMBP的E-51/DDS固化物的玻璃化转变温度(Tg)和初始分解温度都有所提高。加入质量分数为20%的DGE-BHBTMBP可使固化物的Tg和初始分解温度分别提高44℃和21.86℃。当其质量分数为4%时,固化物的力学性能明显提高,冲击强度和弯曲强度分别提高了136%和9%。By using 4,4＇-diaminodiphenylsulfone（DDS）as the curing agent,an epoxy resin based on diglycidyl ether of bisphenol A（epoxy resin E-51）was modified with a novel liquid-crystalline epoxy resin combining biphenyl and aromatic ester-type mesogenic units,diglycidyl ether of 4,4＇-bis（4-hydroxybenzoyloxy）-3,3＇,5,5＇-tetramethyl biphenyl（DGE-BHBTMBP）.The influences of DGE-BHBTMBP on the thermal and mechanical properties of final cured resin systems were investigated by DMA,TGA and SEM.The results showed that DGE-BHBTMBP could increase the glass-transition temperature（Tg）and the initial temperature of decomposition（Td）.Its Tg and Td increased 44鈩？and 21.8鈩？with 20% DGE-BHBTMBP,respectively.The curing system with 4% DGE-BHBTMBP had the good mechanical properties.The impact strength and the bending strength of the cured resin increase by 136% and 9%,respectively.

关 键 词：液晶环氧树脂 环氧树脂 改性 力学性能 热性能 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]