电子包封料用聚氨酯改性环氧树脂的研究  

Study on Polyurethanes Modified Epoxy Resin Used in Electronic Packaging Materials

作　　者：吕红映[1] 陈立新[1] 王建宇[1] 冯波[1] 

机构地区：[1]西北工业大学理学院应用化学系,西安710072

出　　处：《绝缘材料》2010年第1期23-27,共5页Insulating Materials

摘　　要：用聚醚二元醇和2,4-甲苯二异氰酸酯合成了聚氨酯预聚体,并用自制的聚氨酯预聚体对环氧树脂进行了改性。采用红外光谱对所制备的改性环氧树脂进行了官能团结构分析。结果表明,聚氨酯预聚体成功的连入环氧树脂侧链中。采用差示扫描热量法(DSC)研究了改性环氧树脂包封料的反应特性,获得了反应的起始固化温度、固化温度及后处理温度,建立了动力学模型,并对其进行了性能测试。结果表明:该改性环氧树脂具有良好的绝缘性能、耐燃烧性、耐潮性和韧性等,满足一般包封料的要求,可作电子元件包封料的基体树脂。CYD-128 epoxy resin was modified by polyurethane prepolymer which was synthesized with polyester glycol and 2,4-diisocyanatotoluene（TDI）.Then the functional groups of modified epoxyresin were analyzed by means of FTIR,which showed that polyurethane prepolymer was reacted successfully with epoxy resin.The curing properties of the modified epoxy packaging material were studied by DSC;and the initial curing temperature,peak curing temperature,post-processing temperature and a kinetic model of curing were obtained.Finally the electrical property,combustion resistance,humidity resistance and impact resistance of the modified material were tested,which indicated that the polyurethane prepolymer modified epoxy resin can be used in electronic packaging materials.

关 键 词：环氧包封料 聚氨酯 环氧树脂 

分 类 号：TM215[一般工业技术—材料科学与工程] TQ323.5[电气工程—电工理论与新技术]