压力对W-Cu合金电场快速烧结的影响  

Effects of pressure on the electric-field-assisted rapid sintering of W-Cu alloy

作　　者：李娅[1] 冯可芹[1] 吴金岭[1] 柯思璇[1] 文敏[1] 周翔[1] 

机构地区：[1]四川大学制造科学与工程学院,四川成都610065

出　　处：《电子元件与材料》2010年第1期4-7,共4页Electronic Components And Materials

基　　金：四川省学术和技术带头人培养基金资助项目(No.07SRC-08)

摘　　要：采用Gleeble—3500D热模拟机,用电场快速烧结的方法制得W-Cu合金。通过对烧结压坯的密度、显微结构以及硬度的分析,研究了压力对W-Cu合金烧结的影响。结果表明：W-Cu合金在800℃、3 min内快速烧结可获得晶粒较细小、显微组织较均匀的烧结体;在10~30 MPa范围内加压能有效促进烧结体的致密化,可获得相对密度为92.60%~94.84%的W-Cu合金烧结体。但是随着压力的增加,烧结体的相对密度增加不明显。压力可使该烧结体显微硬度增高。W-Cu alloys were prepared by the electric-field-assisted rapid sintering method using the Gleeble—3500D thermal simulation equipment under various pressures.The effects of pressure on the sintering of W-Cu alloy were studied through analyzing the density,microstructure and hardness of the obtained W-Cu sinters.The results show that W-Cu alloys with fine grains and homogeneous microstructure are obtained after rapid sintering at 800 ℃ for 3 min;With the application of pressure in the range of 10~30 MPa,the densification of sinters is effectively promoted,resulting in the formation of sinters with relative density of 92.6%~94.84%.The density of sinters is increased significantly after 10 MPa pressure is applied,however,the density increases at a much lower rate with increasing pressure further.Moreover,pressure application increases the microhardness of W-Cu alloys.

关 键 词：W-Cu合金 快速烧结 压力 电场 

分 类 号：TQ174.652[化学工程—陶瓷工业]