PCB化学镀镍漏镀现象分析  

Analysis of Skip Plating Phenomenon of Electroless Nickel Plating on PCB

作　　者：胡光辉[1] 潘湛昌[1] 魏志钢[1] 

机构地区：[1]广东工业大学轻工化工学院,广东广州510006

出　　处：《印制电路信息》2010年第6期45-48,共4页Printed Circuit Information

摘　　要：文章阐述了不同尺寸铜盘连接状况、掩蔽作用等对漏洞的影响,发现孤立的小铜盘(0.1mm)比大尺寸的铜盘(>0.1mm)更易发生漏镀,即漏镀易发生在小尺寸铜盘上,主要的原因与置换钯的速率不同相关。至于因掩蔽引发的漏镀现象,主要与平衡电化学势作用相关。在活化过程中,电子转移主要决定了漏镀发生与否。The different scale copper pads connection and the masking effect impact on the skip plating was elaborated. It was found that the small size copper small isolated copper discs（0.1 mm） are more difficult to initiate electroless nickel plating than larger size copper discs（〉0.1 mm）. It means ＂skip plating＂ is easy to take place on small sized copper pad. The main reason might be the different rate of conversion of palladium [Pd（s）]. The ＂skip plating＂ is caused by the covering effect, it is related to the balance of electrochemical potential. The electron transportation happens in the activation process, which mainly determines the ＂skip plating＂ happening or not.

关 键 词：漏镀 化学镀镍 掩蔽作用 铜盘 

分 类 号：TN41[电子电信—微电子学与固体电子学]