EDTA体系无氰碱性镀铜的阴极极化  

Cathodic Polarization of Cyanide-free Alkaline Copper Plating from EDTA Bath

作　　者：陈阵[1] 郭忠诚[1] 周卫铭[1] 武剑[1] 王永银[1] 

机构地区：[1]昆明理工大学,昆明650093

出　　处：《表面技术》2010年第3期71-73,共3页Surface Technology

基　　金：云南省教育厅科学研究基金(08Y0071)

摘　　要：研究了EDTA体系无氰碱性镀铜电解液中络合比不同、镀液成分(主盐、导电盐、辅助络合剂)浓度不同及pH值不同时的阴极化曲线,讨论了镀液组分浓度及工艺参数变化对阴极极化的影响,并确定了最佳取值。研究结果表明:增大络合比、降低Cu2+浓度、增大硝酸钾浓度以及加入较高浓度的酒石酸钾钠均可增大阴极极化,pH值在工艺范围内对极化没有明显影响。By studying the cathodic polarization curves under different complex-ratio,bath concentration（including the concentration of main salt,conductive salt and anxiliary complexing agent） and pH in EDTA bath of cyanide-free alkaline copper plating,the influences of bath composition on the cathodic polarization were discussed.The results indicate that increasing complex-ratio,lowering the concentration of Cu^2＋,and using higher concentration of KNO3 and KNaC4H4O6 will make a great contribution to increase the cathodic polarization,pH has no significant effect on the polarization.

关 键 词：无氰镀铜 碱性 极化曲线 镀液性能 

分 类 号：TQ153.1[化学工程—电化学工业]