高脉冲功率密度复合磁控溅射电源研制及放电特性研究  

Development and discharge behavior of high power density pulse magnetron sputtering system

作　　者：田修波[1] 吴忠振[1] 石经纬[1] 李希平[1] 巩春志[1] 杨士勤[1] 

机构地区：[1]哈尔滨工业大学现代焊接生产技术国家重点实验室等离子体表面技术与设备研究所,哈尔滨150001

出　　处：《真空》2010年第3期44-47,共4页Vacuum

摘　　要：高功率脉冲磁控溅射技术(HPPMS)由于能够产生较高的离化率而受到人们的重视。为了提高离化率/沉积速率协同效应,基于直流和脉冲耦合叠加技术我们研制了高功率密度复合脉冲磁控溅射电源,并对高功率复合脉冲磁控溅射放电特性进行研究。结果表明脉冲峰值电流随脉冲电压的增加而增加,但随着脉冲宽度的增加而减小。在高功率脉冲期间工件上获得的电流可以增加一个数量级以上,表明磁控离化率得到显著增强。As a new technology with high ionization rate of sputtered materials,the HPPMS（high power pulse magnetron sputtering） system has been investigating widely.A new-type hybrid HPPMS system was developed coupling DC with pulse power supply in parallel so as to get both the high deposition efficiency and high ionization rate.Then,the discharge behavior of HPPMS system was investigated,and the results revealed that the peak pulse current increases with pulse voltage but decreases with increasing pulse duration.During pulse high-power discharge,the substrate current may increase by over an order of magnitude,ie.,the ionization rate is substantially enhanced.

关 键 词：高功率脉冲复合磁控溅射 峰值电流 放电特性 

分 类 号：O484[理学—固体物理] TB43[理学—物理]