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作 者:王军丽[1] 史庆南[1] 钱天才[1] 王绍华[1] 杨喜昆[1]
机构地区:[1]昆明理工大学分析测试研究中心,昆明650093
出 处:《航空材料学报》2010年第3期14-18,共5页Journal of Aeronautical Materials
基 金:国家自然科学基金(50804018;50564005);云南省自然科学重点基金(2003E0003Z);云南省教育厅科学研究基金(08Y0055);昆明理工大学科学研究启动基金
摘 要:采用大变形异步叠轧并结合退火处理制备出了超细晶铜材。讨论了大变形异步叠轧的搓轧区、界面以及变形量等技术特征,测试了超细晶铜材的组织及性能。结果表明,搓轧区的存在促进了界面的复合和晶粒的细化;纯铜经过室温六道次AARB变形(累积真应变4.01)后,包含有许多亚结构,之后再经过220℃/35min退火处理,亚结构消失,获得了平均晶粒大小为200nm、抗拉强度、屈服强度分别为424.5MPa,323.1MPa、电导率为76.3 MS.m-1的高强高导超细晶铜;晶界面积的增加提高了超细晶铜的显微硬度;超细晶粒的变形不均匀性小和应力集中小,使得超细晶铜的塑性好、强度高;超细晶铜材的塑性变形机制受晶界行为控制。Ultra-fine-grained copper was prepared by asymmetrical accumulative rolling bonding(AARB) with annealing.The main characteristics of AARB technology were discussed,including rubbed rolling area,interface and deformation rate,the structures and properties were measured.The results show that the rubbed rolling area promotes the interface recombination and grains refinement.There are much sub-structures within oxygen-free copper after AARB for six passes with 4.01 cumulative true,thereafter,when annealed by 220℃/35min,the sub-structures disappear and the ultra-fine-grained copper with high strength and conductivity has been obtained,which grain size is 200nm,tensile strength and yield strength are 424.5MPa and 323.1 MPa respectively and electrical conductivity is 76.3MS/m.The increase of grain boundary area of ultra-fine-grained copper increases the microhardness.Small uneven deformation and stress concentration for ultra-fine grained copper lead to a better good plastic and higher intensity.The plastic deformation mechanism of ultra-fine-grained copper is controlled by grain boundary.
分 类 号:TG339[金属学及工艺—金属压力加工]
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