PI/SiO_2复合薄膜导热性能理论预测和实验验证  

Theoretical and Experimental Evaluation of Thermal Conductivity of Polyimide/Silica Composite Films

作　　者：蔡岸[1,2] 杨莉萍[1] 雒彩云[1] 陈江平[2] 奚同庚[1] 

机构地区：[1]中国科学院上海硅酸盐研究所,上海200050 [2]上海交通大学,上海200240

出　　处：《航空材料学报》2010年第3期61-65,共5页Journal of Aeronautical Materials

基　　金：国家自然科学基金资助项目(50706057)

摘　　要：在对复合材料导热性能的多种预测模型进行理论分析和对比研究的基础上,应用自行研制的亚微米/微米薄膜材料热性能测试仪和差示扫描量热仪(DSC)对聚酰亚胺(PI)及其复合薄膜PI/SiO2的热扩散率和比热进行了实验研究,通过导热系数实测值和模型预测值的对比,显示预测模型中考虑填充颗粒尺寸分布的Sorin模型预测值与实验值更为吻合。理论预测和实验研究均表明,在20～160℃温区内,PI/SiO2的导热系数随着SiO2添加量的增加和温度升高呈现明显增大的趋势。Different models for thermal conductivity prediction of composite materials were evaluated and analyzed with experimental values.Laser flash method and differential scanning calorimeter were employed to carry out the measurements of thermal diffusivity and specific heat of polyimide/silica composite films with different silica contents.The thermal conductivity was calculated and compared with prediction and the results show that the Sorin model considering filler size distribution fits better with experimental data.Both prediction and experimental values indicate that thermal conductivity of polyimide/silica composites increases with the increase of silica content,and increases with temperature rise in temperature range 20～160℃.

关 键 词：PI/SiO2复合薄膜 导热系数 预测模型 激光脉冲法 

分 类 号：TB333[一般工业技术—材料科学与工程]