Cu包覆W粉体的制备工艺及表征  

Fabrication and characteristic of the tungsten powder coated by copper

作　　者：陈文革[1] 胡可文[1] 石乃良[1] 

机构地区：[1]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《兵器材料科学与工程》2010年第3期15-18,共4页Ordnance Material Science and Engineering

基　　金：陕西省教育厅自然科学基金(08JK367)

摘　　要：在自制的设备上针对不同粒度的钨粉采用化学镀制备铜包覆钨粉末,用扫描电子显微镜、能谱仪和X射线衍射仪研究包覆粉末的形貌、成分和物象组成。结果表明,镀层均匀,镀层厚度达到0.45μm。钨粉表面化学镀铜的最佳工艺为:五水硫酸铜20 g/L;酒石酸钾钠13.6 g/L;乙二胺四乙酸二钠27.3 g/L;甲醛15 ml/L;pH=12;温度约60℃、钨粉粒径10μm。The tungsten powder coated by copper was prepared by chemical plating with self-made equipments.The microstructure and component of coating powder was observed by the scanning electronic microscopy and X-ray diffraction instrument.The results show that chemical plating method can prepare the copper coated tungsten powder,the coating is uniform and the thickness achieves 0.45 μm.The optimun technological parameters of chemical plating on the tungsten powder surface are that copper sulfate is 20 g/L,sodium potassium tartrate is 13.6 g/L,disodium ethylenediamine tetraacetate is 27.3 g/L,formaldehyde is 15 ml/L,pH value equals 12,temperature is 60 ℃,the size of tungsten powder is 10 μm.

关 键 词：化学镀 包覆粉末 制备工艺 正交试验 

分 类 号：TB33[一般工业技术—材料科学与工程]