用于电子器件冷却的热管散热器实验研究与优化数值模拟  

Experimental study and numerical simulation optimization of heat pipe radiator on electronic devices cooling

作　　者：陆佩强[1] 诸凯[1] 刘建林[1] 杨爱[1] 田金颖[1] 

机构地区：[1]天津商业大学天津市制冷技术重点实验室,天津300134

出　　处：《低温工程》2010年第3期56-60,共5页Cryogenics

摘　　要：高热流密度器件的热控制在CPU结构体系由单一芯片向多核芯片发展中占有重要地位。对平板型热管散热器与普通散热器的传热性能进行了比较研究与计算分析。研究结果表明,热管散热器有效提高CPU芯片散热性能,其关键是强化了散热器底板的传热性能。科学提出用当量导热系数的概念来评价换热器强化传热效果的方法,根据CPU芯片的发热特点提高散热器的当量导热系数可明显提高散热器的均温性,以此提高其换热效率。With the rapid development of the computer, the structure of CPU was developed from the traditional single chip to the multi-core chip. Thermal control of the high heat flux equipment will take an important position in the development of CPU. Referring to the experimental research and numerical was analyzed on the performance of the flat plate heat pipe radiator and the general radiator. The results show that fiat plate heat pipe radiator can effectively improve the cooling performance. It is a key that enhances the heat of radiator floor. It has proposed that equivalent thermal conductivity to evaluate the effect of heat transfer. According to the characteristics of CPU, the equivalent thermal conductivity＇ s reform can significantly improve the temperature of the radiator and heat transfer efficiency.

关 键 词：高热流密度器件 热控制 CPU 平面热管 散热器 

分 类 号：TB657[一般工业技术—制冷工程]