H-MVIP与ST-BUS双向通信解决方案  

Bi-directional Communication Scheme Between H-MVIP and ST-BUS

作　　者：孙富明[1] 李利[2] 潘光荣[1] 王沁[1] 

机构地区：[1]北京科技大学信息工程学院,北京100083 [2]北京城市学院应用技术学部,北京100083

出　　处：《计算机工程》2010年第12期245-247,共3页Computer Engineering

摘　　要：为满足高密度多厂商集成协议(H-MVIP)和串行电信总线(ST-BUS)在通信领域中的应用需求,提出两者之间的双向通信解决方案。采用状态机结合硬件描述语言的设计方式,在现场可编程门阵列上实现整个方案,包括同步、接收、缓存、总线生成与转换、监测等模块。实验结果证明了该方案的可行性。In order to meet the application demands of H-MVIP and ST-BUS in communication field, this paper proposes a bi-directional communication scheme between H-MVIP and ST-BUS. It uses HDL language combined with state machine as design entry, the whole design is implemented in FPGA chip, including synchronization, receiving, buffering, bus generation and conversion, monitoring, etc. Experimental results show the feasibility of this scheme.

关 键 词：高密度多厂商集成协议 串行电信总线 状态机 现场可编程门阵列 

分 类 号：TP303[自动化与计算机技术—计算机系统结构]