浅析砂轮划片机划切工艺  

Shallow Analysis on the Technics of Grinding Wheel Dicing Saw

作　　者：文赟[1] 王克江[1] 孙敏[1] 杨云龙[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京东燕郊065201

出　　处：《电子工业专用设备》2010年第6期21-26,共6页Equipment for Electronic Products Manufacturing

摘　　要：介绍了砂轮划片机的划切原理以及砂轮刀具的构成,并对影响划切品质的因素进行了分析,结合以往实验结果,得到了砂轮划片机的常规划切工艺,既通过优化划切参数和对刀片的选择,达到减小崩裂,提高划切品质的效果。This paper introduced the theory of dicing saw and the composing of the blade, analyzed the factors which affected the dicing. In order to get the general technics research of the dicing saw, we analyzed the factor and the result of experiment before. Through the optimizing the dicing parameters and the choosing of the blade, the achievement had improved the quality of the dicing.

关 键 词：砂轮划片机 刀具 划切工艺 划切参数 

分 类 号：TN305.1[电子电信—物理电子学]