纳米Ag颗粒增强复合钎料蠕变性能的研究  

Creep Properties of Ag Nanoparticle Reinforced Sn-Cu Composite Solders

作　　者：邰枫[1] 郭福[1] 申灏[1] 刘建萍[1] 

机构地区：[1]北京工业大学,北京100124

出　　处：《稀有金属材料与工程》2010年第6期1005-1008,共4页Rare Metal Materials and Engineering

基　　金：北京市科技新星计划(2004B03);霍英东基金(104016)

摘　　要：制备纳米Ag颗粒增强的Sn-Cu基复合钎料。研究不同温度载荷下复合钎料钎焊接头的蠕变断裂寿命,并与Sn-0.7Cu基体钎料钎焊接头进行对比。此外,确定纳米Ag颗粒增强的Sn-Cu基复合钎料钎焊接头在不同温度和应力水平下的应力指数和蠕变激活能,建立复合钎料钎焊接头的稳态蠕变本构方程。结果表明,在不同的温度和应力下,与Sn-0.7Cu钎料钎焊接头相比,纳米Ag颗粒增强的Sn-Cu基复合钎料钎焊接头的蠕变断裂寿命均有所提高,且具有更高的蠕变激活能,说明复合钎料钎焊接头具有更优的抗蠕变性能。Reinforced Ag nanoparticles were incorporated into Sn-0.7Cu matrix composite solder by a mechanical means in order to improve the creep properties of the solder matrix. The creep-rupture life was studied of Sn-0.7Cu solder joints and composite solder joints reinforced with Ag nanoparticles at different temperatures and applied stresses. Stress exponents and creep activation energy were calculated for Ag nanoparticle reinforced Sn-Cu matrix composite solder joints at different temperatures and stress levels. Steady-state creep constitutive equation of the composite solder joint was established. Results show that at different temperatures and stresses, Ag nanoparticles reinforced Sn-Cu composite solder joints have higher creep rupture life and creep activation energy than Sn-0.7Cu solder joints. It indicates the creep resistance of the composite solder joint with 1 vol% Ag reinforcement addition is better than that of Sn-0.7Cu solder joint

关 键 词：纳米颗粒 复合钎料 蠕变断裂寿命 蠕变激活能 蠕变本构方程 

分 类 号：TG425[金属学及工艺—焊接]