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作 者:葛建芳[1] 蒲侠[1] 李思东[1] 唐正华[1]
机构地区:[1]仲恺农业工程学院化学化工学院,广东广州510225
出 处:《仲恺农业工程学院学报》2010年第2期35-38,共4页Journal of Zhongkai University of Agriculture and Engineering
摘 要:以正硅酸乙酯(TEOS)、六甲基二硅氧烷(MM)为主要原料,并通过加入第三单体,在酸性条件下水解缩合,对MQ硅树脂进行改性,合成了耐热性能优良,并具有一定疏水性的电路板敷形专用MDQ硅树脂.采用热失重分析(Thermogravimetric analysis,TGA)、差示量热分析(Differential Scanning Calorimetric,DSC)、傅立叶红外光谱分析(Fourier transform infrared spectrometry,FTIR)等对制得的MDQ硅树脂进行分析表征.结果表明,m(DDS)∶m(TEOS)比值增大,MDQ硅树脂的接触角增大,熔融温度降低,吸热焓变小,失重率增大.Silicone resin was synthesized by the hydrolysis of tetraethyl orthosilicate and hexamethyldi-siloxane in acidic condition.By a third monomer addition,the modified MQ(MDQ) resin for conformal coating was synthesized with excellent performances such as super heat resistance,speed film formation,good gloss and hydrophobicity.Characterization of the obtained MDQ resin were performed with TG,DSC,FTIR etc.The results showed that,with the increasing of the rate of m(DDS)∶m(TEOS),the endothermic enthalpy and melting point of the MDQ resin decreased,while the weight loss percentage and the contact angle of the obtained hybrid resin film increased.
分 类 号:TQ323[化学工程—合成树脂塑料工业]
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