ABS塑料电镀Ni-W合金  

Electroplating of nickel-tungsten alloy on ABS plastic

作　　者：舒畅[1] 谢光荣[1] 朱有兰[1] 

机构地区：[1]广东工业大学材料与能源学院

出　　处：《电镀与涂饰》2010年第7期5-8,共4页Electroplating & Finishing

基　　金：广东省教育部产学研结合项目(2009A090100022)

摘　　要：摘要：介绍了ABS塑料上电镀Ni—w合金的工艺流程，主要包括：去应力，除油，酸洗，粗化，中和，一次还原，浸酸，敏化，活化，二次还原，化学镀铜，弱浸蚀，加厚镀酸铜，电镀Ni-w合金和干燥。Ni—w合金电镀液的组成为：六水合硫酸镍，二水合钨酸钠，柠檬酸和氨水（DH调整剂）。在六水合硫酸镍和二水合钨酸钠总质量浓度为210g／L，柠檬酸用量等于硫酸镍与钨酸钠的总物质的量的条件下，采用正交试验讨论了六水合硫酸镍与二水合钨酸钠的质量浓度之比、镀液温度、pH和电流密度对镀层显微硬度、耐磨性、结合力和表面形貌的影响。得出最佳工艺条件为：六水合硫酸镍60g／L，二水合钨酸钠150g／L，柠檬酸130g／L，镀液温度65℃，·pH5，电流密度20A／dm2，施镀时间45min，以镍板为阳极，采用磁力搅拌。该工艺所得镀层表面细致平整、较有光泽，具有较高的显微硬度、良好的结合力和优异的耐磨性能。The process flow for electroplating Ni-W alloy on ABS plastic was introduced, mainly including stress relieving, degreasing, pickling, roughening, neutralizing, first reduction, acid dipping, sensitizing, activating, second reduction, electroless copper plating, slight etching, acid copper plating for thickening, Ni-W alloy electroplating and drying. The Ni-W alloy electroplating bath is composed of NiSO4·6HaO, NazWO4·2H2O, citric acid and NH3·H2O （used as pH modifier）. The effects of the mass concentration ratio of NiSO4·6H2O to Na2WO4·2H2O, bath temperature, pH and current density on the microhardness, wear resistance, adhesion strength and surface morphology of deposit were discussed through orthogonal test provided that the total mass concentration of NiSO4·6H2O and Na2WO4·2H2O is 210 g/L and the amount of citric acid is equal to the total moles ot NlSO4·OH2O and Na2WO4·2H20. the optimal process condi＇tions are as follows： NiSO4.6H20 60 g/L, Na2WO4·2H2O 150 g/L, citric acid 130 g/L, temperature 65 ℃, pH 5, current density 20 A/dm2, plating time 45 min, Ni sheet as anode, and magnetic agitation. The deposit obtained by the process features fine and smooth surface, high luster, high microhardness, good adhesion, and excellent wear resistance.

关 键 词：ABS塑料 镍-钨合金 电镀 显微硬度 结合力 耐 磨性 

分 类 号：TQ153.2[化学工程—电化学工业]