铝/镀银层/钢的扩散钎焊及界面化合物的生长行为  

Diffusion brazing of Al/Ag plating layer/steel and growth behavior of interface compound

作　　者：吴铭方[1,2] 司乃潮[1] 陈健[2] 

机构地区：[1]江苏大学材料科学与工程学院,镇江212013 [2]江苏科技大学材料科学与工程学院,镇江212003

出　　处：《中国有色金属学报》2010年第6期1209-1213,共5页The Chinese Journal of Nonferrous Metals

基　　金：江苏省研究生创新计划资助项目(CX08S_008Z)

摘　　要：采用扩散钎焊方法对6063铝合金/镀银层/1Cr18Ni9Ti不锈钢进行焊接,探讨焊接界面金属间化合物的生长行为。结果表明:钎缝中靠近不锈钢一侧为Fe-Al金属间化合物层,靠近铝合金一侧主要是Ag(Al)固溶体,中心区域由Ag-Al化合物和Ag(Al)固溶体混合而成;随着低温扩散保温时间的延长,化合物层厚度随之增加,Ag在铝合金一侧富集出现晶界渗透现象;钎缝中首先产生Ag-Al金属间化合物,之后共晶液相中的Al原子穿越Ag-Al金属间化合物层和残余镀银层扩散至不锈钢一侧,与Fe原子生成Fe-Al金属间化合物;在任意给定的扩散钎焊低条件下,可以对化合物层厚度进行初步估算。The 6063 Al alloy/Ag plating layer/1Cr18Ni9Ti was joined by diffusion brazing.The growth behavior of the intermetallics（IMC） at the interface was discussed.The results show that Fe-Al IMC layer and Ag（Al） solid solution form in the side of stainless steel and Al alloy in the joint,respectively.Meanwhile,the microstructure at the centre zone is composed of Ag-Al IMC and Ag（Al） solid solution.As the diffusion holding time at low temperature is prolonged,the thickness of IMC layer increases.The grain boundary penetration is obvious due to the side of Al alloy rich in Ag.Ag-Al IMC forms initially,and then Fe-Al IMC occurs as Al atom diffusing through Ag-Al IMC layer and residual Ag plating layer and reacting with Fe atom in the stainless steel.The thickness of IMC layer can be estimated in the optional given condition of diffusion brazing.

关 键 词：铝合金 6063铝合金 不锈钢 AG 扩散钎焊 化合物生长 

分 类 号：TG454[金属学及工艺—焊接]