电子装联过程中常见焊接缺陷及解决办法  

Several Familiar Soldering Defects in Electronics Assembly and Measures to Solve Them

作　　者：鲜飞[1] 周岐荒 

机构地区：[1]华中数控股份有限公司,湖北武汉430223

出　　处：《印制电路信息》2010年第7期56-59,共4页Printed Circuit Information

摘　　要：在电子装联过程中会不可避免地出现焊接缺陷。文章结合作者工作中的体会和经验,对采用SMT生产的印制电路组件中出现的几种常见焊接缺陷现象进行了分析,并总结了一些行之有效的解决措施,希望能对相关技术人员有所帮助。Soldering Defects will inevitably happen in Electronics Assembly. The article takes the author’s experience as a example, analyses several familiar soldering defects in printed circuit assembly that utilizes surface mount technology （SMT） and summarizes some valid measures to eliminate these defects. It is expected that there will be some reference value to related technical personnel.

关 键 词：表面贴装技术 焊接缺陷 焊锡球 焊桥 立碑 

分 类 号：TN305.94[电子电信—物理电子学]