基于自由空间光学的光机电混合集成技术  

Hybrid Opto-electro-Mechanical Integration Technologies Based on Free-space Optics

作　　者：张流强[1] 

机构地区：[1]重庆大学光电工程学院,重庆400044

出　　处：《半导体光电》2010年第3期390-396,401,共8页Semiconductor Optoelectronics

基　　金：国家自然科学基金项目(60307006)

摘　　要：随着微加工技术和微分析技术的发展,人们已经可以把大型的机电系统或者光学系统微型化并进行某种程度的集成。但是,由于光学元件和光学系统对微结构的材料性能、几何尺寸和表面质量等都有极为苛刻的要求,光学系统特别是自由空间光学系统的微型化仍然面临巨大的技术挑战。提出一种基于表面压印和三维铸模技术的自由空间光学系统集成技术,该技术解决了光学元件的微型化及层内和层间的光学互联;在此基础上,结合MEMS技术、印刷电路(PCB)和表面贴装(SMD)技术实现了片上的光机电混合集成。With the development of micro process and micro analysis,macro eletromechanical systems or optical systems have already been minimized and somewhat integrated. However,since optical components and optical systems put critical requirements on material properties,geometry size and surface quality of microstructures,the miniaturization and integration of optical systems,especial free space optical systems are still a technological challenge. In this paper,an integration technology based on surface imprinting and bulk molding is proposed for free space optical systems. This technology realizes the miniaturization of optical parts and the optical interconnection of in layer or out of layer,based on which,the on-chip hybrid opto-electro-mechanical integration can be realized by combining micro-electro-mechanical system （MEMS） technology,printing circuit board （PCB） technology with surface mounting device （SMD） technology.

关 键 词：光机电集成 混合集成 微光学 表面压印 三维铸模 

分 类 号：TG580.233[金属学及工艺—金属切削加工及机床]