热处理工艺对Ni-P化学镀层硬度的影响  

Effect of Heat Treatment Process on Hardness of Chemical Plating Ni-P

作　　者：刘贯军[1] 徐尧锋[1] 王帅兵[1] 王振东[1] 

机构地区：[1]河南科技学院机电学院,河南新乡453003

出　　处：《热加工工艺》2010年第12期103-105,146,共4页Hot Working Technology

基　　金：河南科技学院大学生科技创新基金资助项目(20080024);河南科技学院博士启动基金资助项目(20070034)

摘　　要：以Ni-P合金化学镀层硬度为研究对象,采用均匀设计方法分别对五种不同P含量的Ni-P合金化学镀层的加热温度和加热时间进行了优化及分析。结果表明,在实验条件下,Ni-P合金化学镀层的最大硬度与加热温度关系较大,与加热时间关系不大;而且,当加热温度为400～430℃时,镀层硬度出现极大值;Ni-P合金化学镀层在热处理条件下的最大硬度值随镀层中P含量的增加而增大。The hardness of chemical plating Ni-P with different P contents were investigated. The heating temperature and time of the different deposits was optimized and analysed by uniform design method, respectively. The results show that the relation between maximum hardness of Ni-P deposit and heat treatment temperature is greater, while tittle effect on heat treatment time under the experimental conditions, and the maximum of deposit hardness appears when heating at 400 430 ℃. Maximum hardness of the chemical plating Ni-P increases with the increase of P content under heat treatment conditions.

关 键 词：热处理 化学镀NI-P 硬度 均匀设计 

分 类 号：TG166.7[金属学及工艺—热处理]