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作 者:丁志敏[1] 宋建敏[1] 沈长斌[1] 方敏[2]
机构地区:[1]大连交通大学,辽宁大连116028 [2]贵州大学,贵州贵阳550003
出 处:《稀有金属材料与工程》2010年第A01期422-424,共3页Rare Metal Materials and Engineering
基 金:辽宁省高等学校重点实验室项目(2008S038)
摘 要:对A1C13-NaC1-KC1三元无机熔融盐体系中低温电镀铝的反应步骤及速率控制步骤进行分析,对电镀过程中镀液成分以及镀铝层沉积质量进行了测定。结果表明低温熔融盐电镀铝镀液中各反应物浓度及温度等因素与铝在阴极沉积速率间存在着定量关系,由此推导出镀铝层沉积速率的动力学经验方程式:υ=2.0697[Al2Cl7-]2.5834[AlCl4-]-0.4707exp[12.04(T403T)]。结果显示,Al2Cl7-的浓度控制着整个电镀过程的进行。从而,从动力学角度解释并丰富了低温熔融盐电镀铝理论。Low-temperature reaction of aluminum electric steps and rate determining step of AlCl3-NaCl-KCl ternary molten salt system were analyzed, the process of electroplating bath composition and the quality of aluminum layer deposition were determined. The results show that there is a corresponding quantitative relationship between aluminum electrical reactant concentration and temperature of low-temperature bath on the deposition rate of AI in the cathode. The empirical equation for the electroplating deposition was summarized as v=2.0697[Al2Cl7^-]^2.5834[AlCl4^-]^-0.4707exp[12.04(T-403/T)] The results show that, Al2Cl7^- concentration of control over the conduct of the entire plating process. Thus, from the kinetic point of view the theory of low-temperature molten salt si explained and enriches it.
分 类 号:TG174.441[金属学及工艺—金属表面处理] TQ153.19[金属学及工艺—金属学]
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