激光冲击SiCp/Cu复合材料的有限元模拟  

Finite Element Simulation of Laser Shock Processing SiCp/Cu Matrix Composites

作　　者：张洁[1] 孙爱华[1] 祝乐[1] 顾祥[1] 戈晓岚[1] 

机构地区：[1]江苏大学,江苏镇江212013

出　　处：《稀有金属材料与工程》2010年第A01期444-447,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金项目(50675089);江苏省高技术研究计划项目(BG2007033)

摘　　要：为了探究激光冲击强化对SiCp/Cu复合材料力学性能的影响,采用有限元分析软件ANSYS/LS-DYNA对复合材料单胞模型进行冲击加载,模拟结果显示:在基体金属上存在着广泛的压应力,并且在载荷作用过程中导致了基体的屈服强化,大大提高了基体的强度;在基体与颗粒增强体之间的界面上存在着一定的等效应力值。采用WDW-200微机控制式电子万能试验机对激光冲击强化前后的试样进行拉伸性能对比试验:发现冲击后试样的抗拉强度较未冲击试样的提高了18MPa,且断口呈现韧窝形貌,为微孔聚集形韧性断裂。结果表明:激光冲击强化提高了SiCp/Cu复合材料的力学性能。In order to study the effect of laser shock processing on the mechanical properties of SiCp/Cu composites, a finite element software ANSYS/LS-DYNA was used to simulate the laser peening of unit cell model for the composites. Results show that there is extensive compressive stress in the matrix which results in the yield hardening of the matrix during loading process, and therefore the matrix strength is improved greatly. There is also equivalent stress in the interface between the matrix and particle reinforcement. The tensile properties of the samples before and after laser shock processing were compared by a WDW-200 universal tensile testing machine. It is indicated that the tensile strength of the shock sample is increased by 18 MPa after laser shock processing, whose fracture presents dimple morphology microvoid-congregated fracture., Results show that the laser shocking processing can improve the mechanical properties of SiCp/Cu composites.

关 键 词：激光冲击强化 SiCp/Cu复合材料:有限元模拟 残余应力 

分 类 号：TN249[电子电信—物理电子学] TB333[一般工业技术—材料科学与工程]