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作 者:董延亮[1] 项利[1] 岳尔斌[1] 仇圣桃[1] 赵沛[1]
机构地区:[1]先进钢铁流程及材料国家重点实验室,钢铁研究总院连铸技术国家工程研究中心,北京100081
出 处:《钢铁研究学报》2010年第7期56-58,共3页Journal of Iron and Steel Research
基 金:国家“十一五”科技支撑计划项目(2006BAE03A14)
摘 要:通过研究以Cu2S为主抑制剂的取向硅钢在薄板坯连铸连轧全流程中的组织演变,比较了工艺优化前后的差别。结果表明,TSCR流程试制的取向硅钢经传统的后工序工艺处理,初次再结晶平均晶粒尺寸约为15.5μm,晶粒度为8.61,生产出来的成品中的二次晶粒的尺寸与普通取向硅钢的相当,成品的性能为B8=1.865 T,P1.7/50=1.409 W/kg;后工序的工艺优化后,初次再结晶晶粒更加细小和均匀,平均晶粒尺寸约为13.6μm,晶粒度为9.13,二次再结晶发展更加完善,成品的磁性能得到提升,为B8=1.884 T,P1.7/50=1.394 W/kg;证明以Cu2S为主抑制剂采用TSCR流程生产取向硅钢是可行的。Microstructure development of grain oriented silicon steel with main inhibitor Cu2S was studied in thin slab casting and rolling total process,conventional and optimized technological process were compared.The results show that through traditional technology,the mean size of primary recrystallization grain is 15.5 μm,grain fineness is 8.61,the grain size of finished product is almost same to that of conventional technological,and B8=1.865 T,P1.7/50=1.409 after technology was optimized,primary recrystallization grains are finer and more uniform,The mean size is 13.6 μm,grain fineness is 9.13,the secondly recrystallization advances perfectly,the magnetic performance is improved,and B8=1.884 T,P1.7/50=1.394 W/kg;techniques to produce grain oriented silicon steel with main inhibitor Cu2S by TSCR is viable.
分 类 号:TG142.7[一般工业技术—材料科学与工程]
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