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作 者:谢宏伟[1] 李训栓[1] 王颖[1] 马朝柱[1] 汪润生[1] 李荣华[1] 宋长安[1] 彭应全[1,2]
机构地区:[1]兰州大学物理学院微电子研究所,兰州730000 [2]兰州大学磁学与磁性材料教育部重点实验室,兰州730000
出 处:《真空科学与技术学报》2010年第4期347-350,共4页Chinese Journal of Vacuum Science and Technology
基 金:兰州大学磁学与磁性材料教育部重点实验室开放课题(No.MMM200811);甘肃省自然科学基金(No.0803RJZA104)
摘 要:载流子迁移率的测量对有机半导体材料及器件的研究极为重要。在总结目前有机半导体迁移率测量方法优缺点的基础之上,本文提出了一种测量有机半导体中载流子迁移率的新方法:用真空蒸镀法制作结构为"金属-有机半导体-金属"的肖特基接触有机半导体器件,通过选取适当的理论模型进行数值计算,然后用理论计算的结果对实验测得的该器件IV特性进行数值拟合,从而得到该有机半导体材料中载流子的迁移率,以及该材料的其他输运参数,如陷阱密度、陷阱特征深度等。本文利用这种方法测量了酞菁铜(CuPc)的空穴迁移率,并得到了CuPc的陷阱密度、陷阱特征深度等参数。A novel technique was successfully developed to evaluate the mobility of a variety of organic semi-conductor materials and devices.In the technique,first,prototyped devices,consisting of metal-organic semiconductor-metal multi-layer with Schottky contact,were fabricated by vacuum deposition,then,its current-voltage characteristics were measured,and finally,the various physical quantities,including the carrier mobility,trap density,and trap distribution,were derived by means of data fitting and data comparison between the measured IV-characteristics and the simulated ones based on optimized models.The hole mobility,trap density and the characteristic trap distribution of copper phthalocyanine (CuPc) were measured in the newly-developed method.
分 类 号:TN304.5[电子电信—物理电子学]
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