细晶W-Cu材料的导电性能  

Electric conductivities of ultrafine W-Cu materials

作　　者：朱松[1] 范景莲[1] 刘涛[1] 田家敏[1] 

机构地区：[1]中南大学粉末冶金国家重点实验室,长沙410083

出　　处：《中国有色金属学报》2010年第7期1360-1364,共5页The Chinese Journal of Nonferrous Metals

基　　金：国家杰出青年科学基金资助项目(50925416);国家自然科学基金资助项目(50874122);国家自然科学基金委员会创新研究群体科学基金资助项目(50721003)

摘　　要：以喷雾干燥-氢还原W-10%Cu(质量分数)、W-20%Cu、W-30%Cu细晶复合粉末为原料,制备工字型拉伸样,并对粉末成分、烧结温度、保温时间对电导率的影响进行研究。结果表明:3种合金中,在1420℃时W-10%Cu和W-20%Cu的相对密度较大,达99.1%;在1380℃时W-30%Cu出现明显的致密化,相对密度最大,达98.7%。1420℃烧结1.5h后材料电导率达到最大,W-10%Cu、W-20%Cu、W-30%Cu的导电率分别为19、25、30MS/m,分别超过GB/T8320—2003的21.8%、27.2%、23.6%。Ultrafine W-10%Cu （mass fraction）, W-20%Cu and W-30%Cu composite powders were synthesized by sol-spray drying and subsequent hydrogen reduction process, and then the obtained powders were die-pressed into I-shaped compacts. The effects of powder composition, sintering temperature and holding time on the electric conductivity were investigated. The results show that among the three alloys, the higher relative densities of the W-10%Cu and W-20%Cu compacts can be obtained at 1 420 ℃ and both the values are 99.1%; significant densification occurs at 1 380 ℃ for the W-30%Cu compact and the maximum relative density is approximately 98.7%. When sintered at 1 420 ℃ for 1.5 h, the electric conductivities of W-10%Cu, W-20%Cu and W-30%Cu compacts reach the maximums of 19, 25 and 30 MS/m, which are 21.8%, 27.2% and 23.6% higher than those of GB/T 8320—2003, respectively.

关 键 词：超细W-Cu合金 电导率 致密化 微观组织 

分 类 号：TG149.411[一般工业技术—材料科学与工程]