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作 者:戴钧明[1] 殷小波[2] 赵德军[3] 王树霞[1] 徐冬冬[1] 钱明球[1]
机构地区:[1]中国石化仪征化纤股份有限公司技术中心,江苏仪征211900 [2]中国石化仪征化纤股份有限公司聚酯生产中心,江苏仪征211900 [3]中国石化仪征化纤股份有限公司销售服务部,江苏仪征211900
出 处:《合成技术及应用》2010年第2期1-3,22,共4页Synthetic Technology & Application
摘 要:笔者针对上期报道[1]中的4个SSP切片进行了性能分析。结果发现常规性能变化趋势与CP相同,DEG在SSP前后基本保持不变;SSP切片的熔融结晶温度Tm c基本相当,比CP的约低15℃左右;冷结晶温度Tc差异较大,与CP趋势一致;SSP切片分子质量分布与CP趋势不同;流变数据发现对温度的敏感性排序为3SSP、4SSP、1SSP、2SSP。The properties of SSP chip from last report were studied.Through analysis,we found that: the change of normal properties of SSP chip was as same as the CP′s,and DEG was not changed after SSP.The Tmc of four SSP chip were equivalent,and they were about 15 ℃ lower than CP′s.Tc of four SSP chip were different from that of CP.Mw/Mn of SSP chip was quite different from that of CP.The order of the value of Eη,from big to small was 3SSP〉4SSP〉1SSP〉2SSP.
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