EDTA体系无氰碱性镀铜工艺研究  

Process research of cyanide-free alkaline copper plating from EDTA system

作　　者：陈阵[1] 郭忠诚[1] 周卫铭[1] 武剑[1] 王永银[1] 

机构地区：[1]昆明理工大学理学院,云南昆明650093

出　　处：《电镀与涂饰》2010年第8期4-7,共4页Electroplating & Finishing

基　　金：云南省教育厅科学研究基金资助项目(08Y0071)

摘　　要：采用碱式碳酸铜为主盐,以EDTA为配位剂,研制了一种无氰碱性镀铜工艺。通过极化曲线、镀层性能的测定,考察了电解液组分和工艺参数对镀层的影响。确定了最佳工艺条件为:Cu2(OH)2CO310～20g/L,C6H5O7K3·H2O25～40g/L,KNO34g/L,配合比2.5,pH11～13,温度50～70°C,电流密度0.5～3.5A/dm2。该工艺镀液稳定,电流效率高,镀层光亮致密,孔隙率低,结合力良好。A cyanide-free alkaline copper plating bath was prepared using Cu2（OH）2CO3 as main salt and EDTA as complexing agent. The effects of the electrolyte components and process parameters on deposit were studied by measuring the polarization curve and testing the coating performance. The optimal process conditions were determined as follows： Cu2（OH）2CO3 10-20 g/L, C6H5O7K3·H2O 25-40 g/L, KNO3 4 g/L, complexing ratio 2.5, pH 11-13, temperature 50-70 ℃, and current density 0.5-3.5 A/dm2. The results showed that the process is characterized by stabilized bath, high current efficiency, bright and compact coating, low porosity and good adhesion.

关 键 词：无氰碱性镀铜 乙二胺四乙酸 极化曲线 结合力 

分 类 号：TQ153.14[化学工程—电化学工业]