激光封口在非致冷型红外焦平面组件封装中的应用研究  

Research on Application of Laser Welding to Uncooling Infrared FPA Detector

作　　者：俞君[1] 沈一璋[1] 王小坤[1] 朱三根[1] 

机构地区：[1]中国科学院上海技术物理研究所传感技术国家重点实验室,上海200083

出　　处：《红外》2010年第8期6-8,共3页Infrared

基　　金：上海技物所三期创新C2-41资助项目

摘　　要：与致冷型红外探测器相比,非致冷型红外探测器无需在系统中安装致冷装置,因此其尺寸较小、重量较轻且功耗较低。为了完善非致冷型红外探测器排气后的封口工艺,并实现探测器组件的结构优化和高可靠性,提出了在高真空环境下利用激光封口来封装非致冷型红外探测器的技术方案。试验表明,组件性能没有发生明显变化,满足工程化应用的要求。Compared with a cooled infrared detector,an uncooled infrared detector has the advangtages of small size,low weight and low power consumption because it has not any cooler.To improve the encapsulation process of an uncooled infrared detector after exhaustion and achieve its configuration optimization and reliability enhancement,a technical scheme to use laser welding to encapsulate the uncooled infrared detector in high vacuum is proposed.The test result shows that the uncooled infrared detector assembly has not apparent variation in performance and can meet the requirements for actual application.

关 键 词：非致冷型红外探测器 激光封口 可靠性 

分 类 号：TN214[电子电信—物理电子学]