WCu合金与铜合金梯度烧结的设计与分析  

Design and Analysis of Gradient Sintering between WCu Alloy and Aldary

作　　者：陈文革[1] 陈勉之[1] 

机构地区：[1]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《高压电器》2010年第8期10-13,共4页High Voltage Apparatus

基　　金：中国博士后基金资助(20060401006)

摘　　要：用梯度烧结法连接钨铜合金与纯铜或铜合金,并与传统的整体烧结、焊接、机械螺纹连接进行了对比分析,观察了结合界面和拉伸断口。结果表明,梯度烧结试样可以显著提高结合界面的抗拉强度(15%～30%)、降低电阻率(25%)。而且梯度烧结试样的界面表现为"犬牙交错"状,断裂方式为准解理,优于界面较为平整,断口呈解理断裂的其他几种连接方式。The copper （aldary）and W-Cu alloy are linked up by the gradient sintering, which is compared with the conventional whole sintering, welding, threaded connection technology. The morphology of the joint and tensile strength are analyzed. Results show that, the gradient sintering W-Cu alloy and aldary has enhanced the tersile strength （15%-30%）and reduced the electric resistivity （25%）. Furthermore the sample＇s interface of gradient sintering is unconspieuous and fractured mode is quasi-cleavage crack. It is better than the other joint mode which interface is clear and the fractured mode is cleavage fracture.

关 键 词：钨铜合金 梯度烧结 铜合金 

分 类 号：TG135.5[一般工业技术—材料科学与工程]