模具温度对聚苯乙烯发泡行为的影响  

Effects of Mold Temperature on the Foaming Behavior of PS

作　　者：贾仕奎[1,2] 何力 孙洪恩[3] 赵武学[3] 朱艳[1] 朱建华 

机构地区：[1]贵州大学材料与冶金学院,贵州贵阳550003 [2]国家复合改性聚合物材料研究中心,贵州贵阳550014 [3]贵州大学化学与化工学院,贵州贵阳550003

出　　处：《塑料工业》2010年第8期39-42,共4页China Plastics Industry

基　　金：贵州省优秀人才省长基金项目(200887);贵州省科技重点攻关项目(20063009)

摘　　要：通过利用自行设计加工的模具,研究了不同模温下聚苯乙烯微发泡试样的发泡行为。揭示了模温升高导致泡孔平均直径长大的真正原因,结果显示不是因为模温升高带动内部熔胶温度的升高而造成熔胶内部泡孔变大,而是因为模具温度升高后,熔胶在高温条件下所保持的时间更长,熔胶长时间保持在高温条件下,熔体强度会降低,对泡孔的束缚力会下降,从而导致泡孔平均直径的增大。This paper studied foaming behavior of PS micro-foaming sample at different mold temperature by a self designed mold.It revealed the real reason for the growing of the cell average diameter with the elevation of mold temperature,the results showed not because of the mold temperature increasing so that melt temperature rising which led the bubble became bigger in melt glue holes,but because after the mold temperature increased,the melt glue under high temperature maintained at the longer,thus the melt strength reduced,the bound force to the foam would fall,so that the average diameter of the cell increased.

关 键 词：模具温度 发泡行为 泡孔尺寸 泡孔密度 熔体强度 

分 类 号：TQ325.2[化学工程—合成树脂塑料工业]