基体偏压对真空脉冲过滤弧沉积TiN涂层表面粗糙度的影响  

Effects of Substrate Bias Voltages on the Surface Roughness of TiN Coatings Deposited by Pulsed Filtered Vacuum Cathode Arc Deposition

作　　者：吴凤芳[1] 邓建新[2] 颜培[2] 

机构地区：[1]山东大学机械工程学院,济南市副教授250061 [2]山东大学

出　　处：《工具技术》2010年第8期16-19,共4页Tool Engineering

基　　金：泰山学者专项基金项目;山东省杰出青年基金项目(JQ200917)

摘　　要：采用离子束辅助真空脉冲过滤弧沉积技术,在硬质合金基体上制备了TiN涂层。对涂层的物理性能和机械性能进行了分析,利用XRD、SEM分别对不同基体偏压下沉积涂层的相组成和表面形貌进行了分析与观察,利用光学轮廓仪对涂层表面轮廓和表面粗糙度进行了测量,分析了基体偏压对TiN涂层表面粗糙度的影响。TiN coatings were produced on a hard metal at different substrate bias voltages by pulsed filtered vacuum cathode arc deposition assisted with ion beam bombardment. The physical and mechanical properties of the coatings were investigated. The phases and surface morphologies of the coatings were analyzed and observed with XRD and SEM respectively. The roughness of the coatings was investigated with the optical profiler. Effects of substrate bias voltages on the surface roughness of the coatings were discussed.

关 键 词：真空脉冲过滤弧 TIN涂层 表面粗糙度 基体偏压 

分 类 号：TG706[金属学及工艺—刀具与模具]