阴离子对化学镀Ni-Cu-P合金耐蚀性的影响  

Effects of Anions on Corrosion behavior of Ni-Cu-P Coating

作　　者：刘重阳[1] 刘贵昌[1] 王随林[2] 王立达[1] 

机构地区：[1]大连理工大学化工学院,辽宁大连116012 [2]北京建筑工程学院城建系,北京100044

出　　处：《辽宁化工》2010年第8期794-796,共3页Liaoning Chemical Industry

基　　金：北京自然科学基金;北京市教委科研攻关计划支持资助;批准号:KZ200810016006;北京市科学技术委员会;课题编号:Z090009040409003

摘　　要：采用化学镀工艺在铜基体表面沉积Ni-Cu-P镀层,利用扫描电镜(SEM)和电子能谱(EDX)对Ni-Cu-P镀层的形貌和成分进行了分析。同时,采用极化曲线(PC)和交流阻抗(EIS)研究了常温下Ni-Cu-P镀层在0.1 mol/L,0.001 mol/L的NaCl,Na2SO4,NaNO3和NaNO2电解质中的耐蚀性能。结果表明,在较高浓度下,氯离子和硫酸根离子的活性吸附作用能够促进镀层中Ni的溶解,从而也加速了镀层的表面钝化,在较低浓度下,氯离子和硫酸根离子的活性吸附作用减弱,镀层很难钝化;硝酸根离子和亚硝酸根离子在高浓度和低浓度下均很难使镀层钝化。Ni-Cu-P coating was synthesized on copper substrate by electroless plating technique.The coating morphology and com-position were characterized by SEM and EDX.The corrosion resistance of Ni-Cu-P coating was studied by PC and EIS.The results show that at a higher electrolyte concentration,Cl-and SO42-ions promote the dissolution rate of Ni by their adsorption,and accelerate the passivation of Ni-Cu-P coating,at lower electrolyte concentration,Ni-Cu-P coating is not easy to passivate as the reducing of the adsorption effect of Cl-and SO42-,NO 3-and NO 2-can not accelerate the passivation of Ni-Cu-P coating either at higher or lower electrolyte concentration.

关 键 词：化学镀 Ni—Cu—P 耐蚀性能 钝化 

分 类 号：TQ153.2[化学工程—电化学工业]