L-半胱氨酸电化学组装膜的研究  

A Study of L-Cysteine Electrochemical Assembled Films

作　　者：韩继红[1] 王春涛[2] 赵永祥[1] 

机构地区：[1]山西大学化学化工学院,山西太原030006 [2]太原师范学院化学系,山西太原030031

出　　处：《电镀与精饰》2010年第8期1-4,共4页Plating & Finishing

基　　金：山西省教育厅高校开发项目(200611039)

摘　　要：通过循环伏安法将L-半胱氨酸电化学组装到铜电极上,用交流阻抗法和循环伏安法研究了循环扫描周数以及组装时间与峰电流的关系,并研究了扫描速度对L-半胱氨酸膜的影响,结果表明L-半胱氨酸膜的氧化峰电流与扫描速度的平方根成正比,说明L-半胱氨酸在铜电极上的电化学组装过程受扩散控制。L-cysteine films were electrochemical assembled on copper electrode using cyclic voltammetry technique.The assembly process and property of assembled L-cysteine films were researched with voltammetry and AC impedance methods.Relationships between peak current and cycle number and between peak current and assembly time were investigated.Influence of potential scanning rate on the quality of the assembled L-cysteine film was also studied.Experimental results of the effect of potential scanning rate on the peak current in the assembly process of L-cysteine film showed that oxidation peak current was directly proportional to the square root of the potential scanning rate.This indicates that assembly process of L-cysteine film on copper electrode was diffusion controlled.

关 键 词：L-半胱氨酸 铜电极 电化学组装膜 

分 类 号：TG174.46[金属学及工艺—金属表面处理]