温度对微波器件镀层结构的影响  

Effect of Temperature on Coating Structure in Microwave Device Electroplating

作　　者：刘仁志 

机构地区：[1]武汉凡谷电子职业技术学校,湖北武汉430074

出　　处：《电镀与精饰》2010年第8期26-29,共4页Plating & Finishing

摘　　要：现代移动通信所使用的微波器件,基于微波的传导特性而对器件的表面特性有很高的要求,如表面光亮度和表面金属组织结构。通常都是采用电镀来获得这种表面结构,致密细小的结晶有利于微波的传导。微观观测表明,温度对镀层的结晶大小有明显影响。例如镀银,只有当温度在30℃以下时,才能获得细致的镀层。这也是微波器件镀银工艺需要采用低温控制系统的原因。Based on microwave conduction characteristics,the requirement for surface characteristics,such as surface roughness and surface metal texture of the microwave devices used in modern mobile communication centre is very high.This kind of surface structure for the microwave devices is usually obtained with electroplating technology.A surface metal layer with fine size crystal and compact texture is advantageous to the microwave conduction.The microcosmic observation results show that temperature has obvious effect on the coating crystal size in electroplating.In silver plating for example,coating with smooth surface of fine size crystal and compact structure can only be obtained at temperature below 30℃.And this is the reason that silver plating technology for microwave devices needs low temperature control system.

关 键 词：微波 镀银 微观结构 温度控制 

分 类 号：TQ153[化学工程—电化学工业]