J-153室温固化低粘度灌注结构胶粘剂　  

J-153 Room-Temperature-Curable Pouring Structure Adhesive with Low Viscosity

作　　者：付刚[1] 匡弘[1] 于昕[1] 杨炳东[1] 付春明[1] 那万才[1] 叶险峰[1] 

机构地区：[1]黑龙江省科学院石油化学研究分院,哈尔滨150040

出　　处：《中国胶粘剂》1999年第2期24-26,共3页China Adhesives

摘　　要：介绍了一种室温固化低粘度灌注使用的结构胶粘剂的研制及主要性能，并与国外同类胶种进行了对比。该胶可作为卫星制造工艺中后埋胶使用，也可用于ＲＴＭ传递模塑成型、电子器件灌封及复合材料结构的修补。The reserch and properties of the room-temperature-curable pouring stracture adhesive with low viscosity were intro- duced and comparisions were made wtih the are kind of adhesives abroad. The adhesive could be used in the postinbuilt processing of the manufacture of Satellies. It could be also used in RTM transfer molding. pouring and sealing of electronic components and repairing of Structure of composites.

关 键 词：环氧树脂 室温固化 灌注 结构胶粘剂 胶粘剂 

分 类 号：TQ436.2[化学工程]