固相法制备细晶高性能PTCR  

Preparation of fine-grained PTCR with high-performance by solid state method

作　　者：陈勇[1,2,3] 傅邱云[1] 张航航[1] 张波[1] 

机构地区：[1]华中科技大学电子科学与技术系,湖北武汉430074 [2]湖北大学物理学与电子技术学院,湖北武汉430062 [3]湖北大学铁电压电材料与器件湖北省重点实验室,湖北武汉430062

出　　处：《华中科技大学学报（自然科学版）》2010年第9期35-37,75,共4页Journal of Huazhong University of Science and Technology(Natural Science Edition)

基　　金：国家高技术研究发展计划资助项目(SQ2008AA03Z4471960)

摘　　要：针对正温度系数热敏电阻(PTCR)片式化技术对陶瓷晶粒尺寸提出的较高要求,利用固相法制备PTCR,结合提高施受主掺杂比(n(Y∶Mn)>21效果明显),高温预烧(1 220℃),低温烧结(1 300℃)等方法抑制晶粒长大;制备出平均晶粒尺寸小于2μm,室温电阻率为205Ω.cm,升阻比为4.082×104的BaTiO3基多层片式细晶PTC陶瓷,使多层片式PTCR产业化成为现实.The PTCR （positive temperature coefficient of resistance） becomes small and small as the chip technology for the development of ceramic was growing. Thus the ceramic with fine-grain was need. The solid-phase method was used by improving the ratio of Y and Mn, in which the method of high pre-sintering temperature and low sintering was effective. When n（Y ：Mn）〉21, the pre-sinte- ring temperature and sintering temperature was separately 1 220 ℃ and 1 300 ℃, the effect was obvious. Through those methods of inhibiting grain growth, the average grain size（less than 2 μm） was achieved, whose resistivity of room temperature was 205Ω· cm, lift-drag ratio was 4. 082×10^4. The fined-grained ceramic of multilayer chip PTC will help in the industrialization.

关 键 词：正温度系数热敏电阻(PTCR) 固相法 BATIO3 细晶 多层 高施主 

分 类 号：TP702[自动化与计算机技术—检测技术与自动化装置] G434[自动化与计算机技术—控制科学与工程]