SiC_P/Al复合材料导热性能研究  

Study on Thermal Conductivity of SiC_P/Al Composite

作　　者：张建云[1] 李亚红[1] 崔霞[1] 周贤良[1] 

机构地区：[1]南昌航空大学材料科学与工程学院,江西南昌330063

出　　处：《热加工工艺》2010年第16期72-74,共3页Hot Working Technology

基　　金：江西省自然科学基金资助项目(2007GZC1634);江西省教育厅科技基金资助项目(GJJ08233)

摘　　要：采用铝液无压浸渗工艺制备了SiCP/Al复合材料,研究了基体金属、颗粒粒径、颗粒体积分数、颗粒形貌对复合材料导热性能的影响。结果表明,以ZL101为基体的该复合材料的热导率高于以纯铝1060为基体的热导率,以纯铝1060为基体的SiCP/Al复合材料存在Al4C3。SiCP/Al复合材料的热导率随SiC颗粒粒径增大而增大,而颗粒体积分数越高,复合材料的热导率越低。近球形SiC颗粒增强复合材料的热导率高于不规则形颗粒增强复合材料的热导率。SiCP /Al composite was fabricated by aluminum liquid pressureless infiltration.The effects of several factors such as matrix metal,particle diameter,volume fraction of SiC particles and particles shape on thermal conductivity of the composite was investigated.The results show that the thermal conductivity of the composite taking ZL101 as matrix is higher than that of taking 1060 pure aluminum as matrix.There is Al4C3 compound in SiCP / 1060Al composites.The thermal conductivity of SiCP /Al composite increases with the increase of SiC particle diameter.The higher the SiC particle volume fraction,the lower the thermal conductivity of the composite.The thermal conductivity of SiCP /Al composite with sphere-like particles is higher than that with irregular particles.

关 键 词：SICP/AL复合材料 无压浸渗 热导率 

分 类 号：TB331[一般工业技术—材料科学与工程]