树脂基复合材料固化过程温度场研究进展  

REVIEW ON TEMPERATURE FIELD IN CURING PROCESS OF FIBER REINFORCED COMPOSITES

作　　者：王志远[1] 陈刚[1] 郑志才[1] 

机构地区：[1]中国兵器工业集团第五三研究所,济南250031

出　　处：《工程塑料应用》2010年第8期85-88,共4页Engineering Plastics Application

摘　　要：综述了树脂基复合材料固化过程中温度场的影响因素及国内外的研究进展,指出温度场研究中存在的问题并对未来的研究进行了展望。The factors affecting the temperature field in curing process of composite and the research progress at home and abroad are reviewed,and the problems exited in the research are pointed out and the next research work is prospected.

关 键 词：复合材料 固化过程 温度场 

分 类 号：TQ323.1[化学工程—合成树脂塑料工业]