SiC_p/B_4C复合陶瓷的热压烧结及组织性能  

HOT-PRESS SINTERING, MICROSTRUCTURE AND PROPERTIES OF SiC_p/B_4C COMPOSITES

作　　者：魏红康[1] 张玉军[2] 邓翔宇[1] 

机构地区：[1]景德镇陶瓷学院,景德镇333001 [2]山东大学材料液态结构及其遗传性教育部重点实验室,济南250061

出　　处：《中国陶瓷》2010年第9期14-16,共3页China Ceramics

摘　　要：以Si粉为烧结助剂,SiC颗粒为增强剂,采用真空热压烧结工艺制备了SiCp/B4C陶瓷基复合材料。研究了SiCp对复合材料力学性能的影响。借助X射线衍射、扫描电镜等分析了复合材料的物相组成和微观结构。研究表明:添加的SiCp中粒径小的颗粒被包裹在主晶相中,粒径较大的颗粒分布在晶界上,形成"晶内-晶间"混合型复合陶瓷。当SiCp含量为4wt.%时,复合材料的弯曲强度和断裂韧性分别达到431MPa和5.41MPa.m1/2。复合材料力学性能的提高主要是由于残余应力引起的晶界强化以及断裂方式的转变。SiCp/B4C composites were prepared by hot pressing under vacuum with Si powder and SiCp as sintering aid and reinforcement agent respectively.The effect of SiCp content on the mechanical properties of composites were studied.Phase composition and microstructure of B4C based composites were characterized by means of XRD and SEM.The results showed that the SiCp of small particle size were embedded into the boron carbide grains,meanwhile,those of big particle size sited along the grain boundaries,and thereby,intra/inter-type ceramics formed.The maximum flexural strength and fracture toughness of 431MPa and 5.41MPa.m1/2 were obtained by addition of 4wt.% SiCp.The improvement in fracture toughness is attributed to the grain boundary strengthening and the change of fracture mode.

关 键 词：碳化硼 硅粉 SICP 力学性能 微观结构 

分 类 号：TQ174.75[化学工程—陶瓷工业]