挤压型化学包覆法AgC(5)触头材料的制备及性能分析  

Preparation and Performance Analysis of AgC(5) Electrical Contact Material by Chemical Co-deposition and Extrusion Manufacturing Process

作　　者：黄光临 宋柯 李素华 颜小芳 

机构地区：[1]福达合金材料股份有限公司,浙江温州325025

出　　处：《电工材料》2010年第3期16-19,共4页Electrical Engineering Materials

摘　　要：采用化学包覆工艺制备AgC(5)复合粉,经冷等静压成型、烧结、挤压成线材,再经专用设备加工成一定规格的产品。与采用机械混粉-模压、机械混粉-挤压、化学包覆-模压等工艺加工的产品进行对比,结果表明,化学包覆-挤压工艺不仅能改善材料组织结构,而且提高了材料的致密度,降低了材料的电阻率,改善了材料的抗氧化性能。In this paper,a manufacturing process of AgC（5） was introduced,which is the AgC（5） powder was made by chemical co-deposition,and then isostatic pressed,sintered,extruded to the wire,at last,the AgC（5） product was shaped by a special machine.The result shows that the material performance of AgC（5） by chemical co-deposition and extrusion manufacturing process is much better than the other manufacturing processes＇,such as the mixing-compcting process,the mixing-extrusion process,the co-deposition-compating process.The material＇s micro-structure is improved,the desity is increased,the resistance is reduced.The AgC（5） made by the chemical co-deposition and extrusion manufacturing process has better micro-structure,higher desity,smaller resistance,better oxidation resistance.

关 键 词：AgC(银石墨) 挤压 化学包覆 电触头材料 

分 类 号：TM205.1[一般工业技术—材料科学与工程]