SINDA/FLUINT仿真软件在电子设备热设计中的应用  

APPLYING SIMULATION SOFTWARE SINDA/FLUINT IN THERMAL DESIGN OF ELECTRONIC DEVICE

作　　者：何崇超[1,2] 张汉勋[1] 

机构地区：[1]中国科学院光电研究院,北京100190 [2]中国科学院研究生院,北京100049

出　　处：《计算机应用与软件》2010年第9期157-159,共3页Computer Applications and Software

摘　　要：热分析软件是广泛应用于各个领域的一种分析工具,SINDA/FLUINT软件基于集总参数—有限差分理论,是目前国内最新引进的航天热辐射及导热设计专业软件,在热分析方面具有强大的功能。根据工程实践经验,首先阐述了电子设备热设计的必要性,然后完成某海洋卫星高度计发射单元电子设备元器件、印制板和机箱的热设计,并采用SINDA/FLUINT热仿真软件建立热分析模型,计算得到各模块及箱体的温度分布,根据分析计算结果提出优化设计建议,圆满完成单机设备的热设计分析及优化工作。Heat analysis is an analytical implement widely used in various areas, and SINDA/FLUINT based on the theory of lumped pa- rameters-finite difference is a latest introduced professional software for aerospace thermal radiation and heat conduction design, which has mighty function for heat analysis. Based on the experiences in engineering practices, the necessity of thermal design was firstly elaborated, and then the thermal designs of the electronic chips, the printed circuit board （PCB） and the outer case of the altitude sensor in an ocean satellite was completed. The thermal analysis models were built in with the software of SINDA/FLUINT, and the temperature distributions of each mod- ule and the case were calculated. According to the analytical calculation, the suggestions for optimising the thermal design were proposed, the thermal design analysis and optimisation for a stand-alone device was successfully completed.

关 键 词：电子设备 热设计 热分析 仿真 

分 类 号：TP391.9[自动化与计算机技术—计算机应用技术]