Cu-Ni-Si-Ag合金动态再结晶数学模型  

Modeling of Dynamic Recrystallization in Cu-Ni-Si-Ag Alloy

作　　者：张毅[1] 刘平[2] 田保红[1] 张轼 陈小红[2] 贾淑果[1] 刘勇[1] 

机构地区：[1]河南科技大学材料科学与工程学院 [2]上海理工大学机械工程学院 [3]洛阳有色金属研究院

出　　处：《特种铸造及有色合金》2010年第9期787-790,共4页Special Casting & Nonferrous Alloys

基　　金：国家高技术研究发展计划(863计划)资助项目(2006AA03Z528);国家自然科学基金资助项目(50571035);河南省杰出青年基金资助项目(0521001200);河南科技大学博士启动基金资助项目(09001414)

摘　　要：利用Gleeble-1500D热模拟试验机,采用高温等温压缩试验,对Cu-2.0Ni-0.5Si-0.15Ag合金在应变速率为0.01～5.00s-1、变形温度为600～800℃、最大变形量为80%条件下的动态再结晶行为以及组织转变进行了研究。根据σ-ε曲线确定了不同变形条件下该合金的动态再结晶体积分数,并利用该体积分数建立了合金的动态再结晶动力学数学模型。该合金动态再结晶的显微组织受变形速率的影响,动态再结晶晶粒尺寸D与Z参数满足如下关系:Ddyn=0.59×103Z-0.08。Dynamic recrystallization behavior and microstructural evolution of Cu-2.0Ni-0.5Si-0.15Ag alloy during hot compressive deformation were investigated by isothermal compression testing at the Gleeble-1500D thermal-mechanical simulator at the temperature from 600℃ to 800℃ with strain rate from 0.01s-1 to 5s-1 under the condition of 60% strain. Recrystallized fraction at varied deformation conditions was determined based on σ-ε curves,which was employed to establish kinetic equation for dynamic recrystallization in the alloy. The dynamic recrystallized microstructure depend on the deformation strain rates. Relationship between the dynamic recrystallization grain and parameter Z is as follows: Ddyn=0.59×103Z-0.08.

关 键 词：Cu-2.0Ni-0.5Si-0.15Ag合金 动态再结晶体积分数 动态再结晶动力学模型 动态再结晶晶粒尺寸模型 

分 类 号：TG146.11[一般工业技术—材料科学与工程] O242[金属学及工艺—金属材料]