冲刷腐蚀纯铜中空位透射电镜研究  

Transmission Electron Microscopy Study on Vacancy in Erosion of Pure Copper

作　　者：周浩[1] 杜磊[1] 张金民[1] 

机构地区：[1]洛阳船舶材料研究所,河南洛阳471039

出　　处：《物理测试》2010年第5期22-24,共3页Physics Examination and Testing

摘　　要：对冲刷腐蚀纯铜试样进行氩离子减薄,利用透射电镜进行组织观察。结果表明,纯铜内存在大量的位错及空位盘。基体与Cu2O共格,在透射电镜下观察到大量的莫尔条纹。Microstructure of erosion of pure copper sample was observed by TEM after Ar＋ ion etching.The results show that there were many dislocations and vacancy plates in the sample.Cu2O is coherent with the matrix,and many moire stripes were found under SEM.

关 键 词：冲刷腐蚀 纯铜 空位 莫尔条纹 透射电镜 

分 类 号：TG172[金属学及工艺—金属表面处理]