无氧铜真空钎焊密封技术研究  

Vacuum brazing technology on sealing non-oxygenic copper

作　　者：王国建[1] 许芳[1] 孙东[1] 田宁[1] 周雅松[1] 

机构地区：[1]中国科学院高功率微波源与技术重点实验室,北京市100190

出　　处：《焊接》2010年第9期33-35,共3页Welding & Joining

摘　　要：采用Ga基钎料对TU1无氧铜漏气材料开展真空钎焊堵漏工艺技术研究,对Ga、Ga-In、Ga-Sn、Ga-In-Sn等不同钎料的封接效果进行分析。结果表明在焊接温度600℃、保温时间60min、真空度5×10^(-3)Pa的条件下,可实现小于5×10^(-9)Pa·m^3/s的漏率指标,并形成均匀、连续的焊缝微观组织结构,满足500℃、20 h的烘烤排气热处理工艺。The leak-rate of non-oxygenic copper vacuum brazed with Ga filler metals were studied, and the comparative analysis of Ga, Ga-In, Ga-Sn and Ga-In-Sn filler metals was carried out. The result indicates that the minimum leak-rate of the joint was less than 5×10^(-9)pa·m^3/s at the temperature 600℃ ,holding time 20min and vacuum level 5×10^(-3)Pa. The continuous and uniform microstructure of brazed joint was formed,which can meet the requirement of heat treatment at 500℃ for 20 hours.

关 键 词：无氧铜TU1 Ga基钎料 真空钎焊 气密性 

分 类 号：TG454[金属学及工艺—焊接]