CuO-磷酸盐胶粘剂粘接机理  

A study on solidifying mechanism of copper oxide phosphate adhesive

作　　者：雷阎盈[1] 余历军[1] 朱玲菊 陈立宇[1] 郝惠娣[1] 

机构地区：[1]西北大学化学工程学系

出　　处：《西北大学学报（自然科学版）》1999年第3期229-232,共4页Journal of Northwest University（Natural Science Edition）

摘　　要：对ＣｕＯ－磷酸盐胶粘剂有关粘接机理进行了剖析，提出ＣｕＯ－磷酸盐胶粘剂调和固化后，主要生成含有“Ｏ－Ｃｕ－Ｏ”侧链，通过“－Ｏ－Ｃｕ－Ｏ－”链桥纵向和横向键合的无机磷酸盐高分子聚合物，是形成高强度粘接内聚力的主要因素，并经红外光谱证实。The solidifying mechanism of copper oxide phosphate adhesive was explored. It was showed that polymerization of copper oxide phosphate adhesive results from the formation of “ O Cu O ” chain during the solidification. The high cohesive strength of copper oxide phosphate adhesive may be ascribed to cross linking of “ O Cu O ” chain in all directions. The above mentioned viewpoint was demonstrated by IR.

关 键 词：氧化铜 胶粘剂 粘接机理 红外光谱 磷酸盐 

分 类 号：TQ433.51[化学工程]